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2016-03-04 1 2016-03-04 chipled? with high power infrared emitter (850 nm) version 1.3 sfh 4053 ordering information features: ? very small package: (lxwxh) 1.0 mm x 0.5 mm x 0.45 mm applications ? miniature photointerrupters ? proximity sensor ? mobile devices ? touchscreen notes depending on the mode of operation, these devices e mit highly concentrated non visible infrared light which can be hazardous to the human eye. products which i ncorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471. type: radiant intensity ordering code i e [mw/sr] i f = 70 ma, t p =20 ms sfh 4053 7 ( 4) q65111a0651 note: measured at a solid angle of ? = 0.01 sr
2016-03-04 2 version 1.3 sfh 4053 maximum ratings (t a = 25 c) characteristics (t a = 25 c) parameter symbol values unit operation and storage temperature range t op ; t stg -40 ... 85 c reverse voltage v r 5 v forward current i f 70 ma surge current (t p 400 s, d = 0) i fsm 0.7 a power consumption p tot 140 mw esd withstand voltage (acc. to ansi/ esda/ jedec js-001 - hbm) v esd 2 kv thermal resistance junction - ambient 1) page 12 r thja 450 k / w thermal resistance junction - soldering point 2) page 12 r thjs 350 k / w parameter symbol values unit peak wavelength (i f = 70 ma, t p = 20 ms) (typ) peak 860 nm centroid wavelength (i f = 70 ma, t p = 20 ms) (typ) centroid 850 nm spectral bandwidth at 50% of i max (i f = 70 ma, t p = 20 ms) (typ) ? 30 nm half angle (typ) ? 70 dimensions of active chip area (typ) l x w 0.2 x 0.2 mm x mm rise and fall time of i e ( 10% and 90% of i e max ) (i f = 70 ma, r l = 50 ?) (typ) t r , t f 12 ns forward voltage (i f = 70 ma, t p = 20 ms) (typ (max)) v f 1.6 ( 2) v forward voltage (i f = 500 ma, t p = 100 s) (typ (max)) v f 2.4 v reverse current (v r = 5 v) i r not designed for reverse operation a total radiant flux (i f = 70 ma, t p =20 ms) (typ) e 35 mw
version 1.3 sfh 4053 2016-03-04 3 grouping (t a = 25 c) temperature coefficient of i e or e (i f = 70 ma, t p = 20 ms) (typ) tc i -0.5 % / k temperature coefficient of v f (i f = 70 ma, t p = 20 ms) (typ) tc v -0.7 mv / k temperature coefficient of wavelength (i f = 70 ma, t p = 20 ms) (typ) tc 0.3 nm / k group min radiant intensity max radiant intensity typ radiant intensity i f = 70 ma, t p =20 ms i f = 70 ma, t p =20 ms i f = 500 ma, t p = 25 s i e, min [mw / sr] i e, max [mw / sr] i e, typ [mw / sr] sfh 4053-p 4 8 35 sfh 4053-q 6.3 12.5 55 note: measured at a solid angle of ? = 0.01 sr only one group in one packing unit (variation lower 2:1). relative spectral emission 3) page 12 i rel = f(), t a = 25c radiant intensity 3) page 12 i e / i e (100 ma) = f(i f ), single pulse, t p = 25 s, t a = 25c parameter symbol values unit 700 0 nm % ohf04132 20 40 60 80 100 950 750 800 850 i rel ohf04406 i f ma 10 5 10 5 10 10 3 1 10 -2 10 -3 10 5 1010 5 -1 5 0 e (70 ma) i e i 0 1 2
2016-03-04 4 version 1.3 sfh 4053 max. permissible forward current i f, max = f(t a ), r thja = 450 k/w forward current 3) page 12 i f = f(v f ), single pulse, t p = 100 s, t a = 25c permissible pulse handling capability i f = f(t p ), t a = 25 c, duty cycle d = parameter 0 0 ?c t a f i ma ohf05343 20 40 60 80 100 10 20 30 40 50 60 70 80 ohf03826 f i 10 -4 0.5 1 1.5 2 2.5 v 3 10 0 a 0 f v -1 10 55 10 -2-3 5 10 10 10 0 -2 -3 -4 -5 10 10 10 f i a p t = d t 2 1 0 -1 10 t p 10 s 10 ohf05344 t t p i f 0.050.2 0.1 0.02 0.01 d 0.005 = 0.51 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
version 1.3 sfh 4053 2016-03-04 5 radiation characteristics 3) page 12 i rel = f(?), t a = 25c package outline dimensions in mm. ohf05523 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ? short axis long axis
2016-03-04 6 version 1.3 sfh 4053 pinning pin description 1 anode 2 cathode package chipled approximate weight: 1 mg note: colour: colourless recommended solder pad dimensions in mm (inch).
version 1.3 sfh 4053 2016-03-04 7 reflow soldering profile product complies to msl level 3 acc. to jedec j-std -020d.01 0 0 s oha04525 50 100 150 200 250 300 50 100 150 200 250 300 t t ?c s t t p t t p 240 ?c 217 ?c 245 ?c 25 ?c l oha04612 profile featureprofil-charakteristik ramp-up rate to preheat* ) 25 c to 150 c 2 3 k/s time t s t smin to t smax t s t l t p t l t p 100 120 60 10 20 30 80 100 217 2 3 245 260 3 6 time25 c to t p time within 5 c of the specified peaktemperature t p - 5 k ramp-down rate*t p to 100 c all temperatures refer to the center of the package, measured on the top of the component* slope calculation d t/ d t: d t max. 5 s; fulfillment for the whole t-range ramp-up rate to peak* ) t smax to t p liquidus temperaturepeak temperature time above liquidus temperature symbolsymbol uniteinheit pb-free (snagcu) assembly minimum maximum recommendation k/sk/s s ss s c c 480
2016-03-04 8 version 1.3 sfh 4053 taping dimensions in mm [inch]. tape and reel 8 mm tape with 2000 pcs. on ? 180 mm reel d 0 2 p p 0 1 p w f e direction of unreeling n w 1 2 w a ohay0324 label leader: trailer: 13.0 direction of unreeling 0.25 min. 160 mm * min. 400 mm * *) dimensions acc. to iec 60286-3; eia 481-d
version 1.3 sfh 4053 2016-03-04 9 tape dimensions [mm] tape dim ensions in m m reel dimensions [mm] reel dim ensions in m m barcode-product-label (bpl) dry packing process and materials note: moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. regarding dry pack you will find further informatio n in the internet. here you will also find the norm ative references like jedec. w p 0 p 1 p 2 d 0 e f 8 + 0.3 / -0.1 4 0.1 2 0.05 or 4 0.1 2 0.05 1.5 0.1 1.75 0.1 3.5 0.05 a w n min w 1 w 2max 180 8 60 8.4 + 2 14.4 oha04563 (g) group: 1234567890 (1t) lot no: (9d) d/c: 1234 (x) prod no: 123456789 (6p) batch no: 1234567890 lx xxxx rohs compliant bin1: xx-xx-x-xxx-x ml x temp st xxx c x pack: rxx demy xxx x_x123_1234.1234 x 9999 (q)qty: semiconductors osram opto xx-xx-x-x example x_x123_1234.1234 x x_x123_1234.1234 x example example example xxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x xx-xx-x-x example example example example example example example xxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x xx-xx-x-x example pack: rxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x example pack: rxx pack: rxx demy demy example 1234 1234 example example example example example example example example example (9d) d/c: (9d) d/c: 1234 1234 example example example example example 1234 1234 example pack: rxx pack: rxx demy example example example example example (9d) d/c: (9d) d/c: example example example example (9d) d/c: 1234 example example example example (9d) d/c: example example example example example example example example example example example example example example example example example example example example example 1234567890 1234567890 example example example example example example example example example example example example example example example example example example example example example example (6p) batch no: (6p) batch no: 1234567890 1234567890 semiconductors semiconductors example example example example example example example example example (6p) batch no: (6p) batch no: 1234567890 1234567890 example semiconductors semiconductors osram opto osram opto example example 1234567890 x_x123_1234.1234 x pack: rxx demy x_x123_1234.1234 x (9d) d/c: 1234 (9d) d/c: 1234567890 (6p) batch no: 1234567890 osram opto xxx x_x123_1234.1234 x xx-xx-x-x pack: rxx demy semiconductors oha00539 osram moisture-sensitive label or print barcode label desiccant humidity indicator barcode label osram please check the hic immidiately after bag opening. discard if circles overrun. avoid metal contact. wet do not eat. comparatorcheck dot parts still adequately dry.examine units, if necessary examine units, if necessary 5% 15% 10% bake unitsbake units if wet, change desiccantif wet, humidity indicator mil-i-8835 if wet, moisture level 3 floor time 168 hours moisture level 6 floor time 6 hours a) humidity indicator card is > 10% when read at 23 ?c 5 ?c, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. after this bag is opened, devices that will be subjected to infrared 1. shelf life in sealed bag: 24 months at < 40 ?c and < 90% relative humidity (rh). moisture level 5a at factory conditions of (if blank, seal date is identical with date code). a) mounted withinb) stored at body temp. 3. devices require baking, before mounting, if:bag seal date moisture level 1 moisture level 2 moisture level 2a 4. if baking is required, b) 2a or 2b is not met. date and time opened: reference ipc/jedec j-std-033 for bake procedure. floor time see below if blank, see bar code label floor time > 1 yearfloor time 1 year floor time 4 weeks 10% rh. _ < moisture level 4moisture level 5 ?c). opto semiconductors moisture sensitive this bag contains caution floor time 72 hoursfloor time 48 hours floor time 24 hours 30 ?c/60% rh. _ < level if blank, seebar code label
2016-03-04 10 version 1.3 sfh 4053 transportation packing and materials dimensions of transportation box in mm width length height 200 5 195 5 30 5 oha02044 packvar: r077 additional text p-1+q-1 multi topled muster osram optosemiconductors (6p) batch no: (x) prod no: 1 0 (9d) d/c: 11 (1t) lot no: 210021998 123gh1234 0 24 5 (q)qty: 2000 0144 (g) group: 260 c rt 240 c r 3 220 c r ml bin3: bin2: q-1-20 bin1: p-1-20 lsy t676 22a temp st r18 demy packvar: r077 additional text p-1+q-1 multi topled muster osram opto semiconductors (6p) batch no: (x) prod no: 1 0 (9d) d/c: 11 (1t) lot no: 210021998 123gh1234 0 2 4 5 (q)qty: 2000 0144 (g) group: 260 c rt 240 c r 3 220 c r ml bin3: bin2: q-1-20 bin1: p-1-20 lsy t676 22a temp st r18 demy osram packingsealing label barcode label moisture level 3 floor time 168 hours moisture level 6 floor time 6 hours a) humidity indicator card is > 10% when read at 23 ?c 5 ?c, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. after this bag is opened, devices that will be subjected to infrared 1. shelf life in sealed bag: 24 months at < 40 ?c and < 90% relative humidity (rh). moisture level 5a at factory conditions of (if blank, seal date is identical with date code). a) mounted withinb) stored at body temp. 3. devices require baking, before mounting, if:bag seal date moisture level 1 moisture level 2 moisture level 2a 4. if baking is required, b) 2a or 2b is not met. date and time opened: reference ipc/jedec j-std-033 for bake procedure. floor time see below if blank, see bar code label floor time > 1 yearfloor time 1 year floor time 4 weeks 10% rh. _ < moisture level 4moisture level 5 ?c). opto semiconductors moisture sensitive this bag contains caution floor time 72 hoursfloor time 48 hours floor time 24 hours 30 ?c/60% rh. _ < level if blank, seebar code label barcode label
version 1.3 sfh 4053 2016-03-04 11 disclaimer language english will prevail in case of any discre pancies or deviations between the two language word ings. attention please! the information describes the type of component and shall not be considered as assured characteristics . terms of delivery and rights to change design reser ved. due to technical requirements components may c ontain dangerous substances. for information on the types in question please con tact our sales organization. if printed or downloaded, please find the latest ve rsion in the internet. packing please use the recycling operators known to you. we can also help you C get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport . for packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of osram os. *) a critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. if they fail, it i s reasonable to assume that the health and the life of the user may be endangered.
2016-03-04 12 version 1.3 sfh 4053 glossary 1) thermal resistance: junction -ambient, mounted on pc-board (fr4), padsiz e 5 mm 2 each 2) thermal resistance: junction - soldering point, of the device only, moun ted on an ideal heatsink (e.g. metal block) 3) typical values: due to the special conditions of the manufacturing processes of led, the typical data or calculated correlations of technical parameters can only reflect statistical figures. these do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data a nd calculated correlations or the typical characteristic line. if requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2016-03-04 13 version 1.3 sfh 4053 published by osram opto semiconductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved.

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